FPC is mainly composed of four parts: CCL (Copper Film), protective film (Cover Film), reinforcing the film (PI Stiffener Film), adhesive film (Adhesive Sheet). Relate to the specific materials as follows:
Copper (copper): Basic divided into two kinds of copper and rolled copper (phone FPC commonly used rolled copper foil). Common thickness is 1oz and 1 / 2oz (1 / 2oz copper thickness = 0.7 mil = 0.018mm.).
Substrate film (base film): Commonly used materials for PI (polyimide). Common thickness 1mil and 1 / 2mil two kinds.
Adhesives: thickness determined in accordance with customer requirements, usually 0.5mil epoxy thermosetting plastic.
Protection film: surface insulation. Commonly used materials for the PI (polyimide). Common thickness 1mil and 1 / 2mil.
Reinforcing film: FPC reinforcing the mechanical strength of the surface-mounted to facilitate operation. Common thickness 5mil and 9mil.
Release paper: Avoid adhesive buildup of foreign matter before pressing, easy point operations.
Reinforcing materials: common is PI (inner shield layer reinforcement), FR4 (inner shield layer reinforcement), steel. Glue between layers of: 1mil thermosetting epoxy glue.
Note: 1mil = 1 / 1000in = 0.025mm. also known as milli-inches mil, mils (thousandths of an inch). 1mm = 40mil.
All, each about the thickness of a single panel for: 0.5mil protective film + 0.5mil thermosetting plastic + 1 / 2oz copper + 0.5mil thermosetting plastic + 0.5mil board = 2.7mil = 0.0675mm.
AWM 20624 80C 60V VW-1 50 Pins Flexible Flat Cable Multi-Layer flexible printed circuit
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